Focus: thermal and mechanical simplification in 230 Vac motor inverter power solution

The GANSPIN61x family is ST’s GaN-based intelligent power module (IPM) for single-phase mains motor drives, optimized for applications where bill of materials, PCB size, and manufacturing simplicity are key constraints. GANSPIN61x integrate a 600 V GaN half-bridge and high-voltage gate driver in a compact 9 × 9 mm QFN package, with comprehensive protection features to cut external components and streamline inverter design.

In this webinar, we explore the system level benefits through the EVLGANSPIN1 3PH reference design — a 230 Vac three phase inverter based on GANSPIN611 and an STM32G431 MCU — achieving over 400 W with significant cost advantages.

In many applications, GANSPIN61x enables heatsink-free motor drives up to 400 W, lowering material cost, inverter thickness, and manual assembly steps, and supporting more automated production. We also compare GANSPIN61x with silicon IPMs and discrete GaN solutions in terms of integration level, external circuitry, layout effort, and scalability, to support total system cost and design decisions.

What you will learn:

• How the GANSPIN61x IPM architecture reduces external components and simplifies inverter partitioning.
  
• How the 230 Vac reference inverter is implemented, and which design choices impact power capability, thermal margin, and PCB area.
  
• Practical BOM and PCB layout guidance, including how dV/dt tuning affects EMI, robustness, and design margins.
  
• How GANSPIN61x compares with silicon IPMs and discrete GaN solutions from a cost, integration, and manufacturability perspective.
  

This session is designed for R&D engineers working on compact motor drives and for purchasing and platform teams evaluating solutions that reduce mechanical complexity while delivering excellent performance.

Agenda

• GANSPIN61x family overview
  
• IPM positioning and key system tradeoffs
• 230 Vac reference inverter walkthrough
• Measurement results and key takeaways
• Live Q&A