Keynote Agenda |
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|---|---|---|---|---|
| Time | Topic | |||
| 08:30 – 09:30 | Registration & Demo Experience | |||
| 09:30 – 09:40 | APeC Strategic Vision | |||
| 09:40 – 10:00 | Taiwan Strategic Vision and ST IDM Model | |||
| 10:00 – 10:20 | Sustainability Vision and Business Commitment | |||
| 10:20 – 11:00 | Coffee Break & Demo Experience | |||
| Time |
Topic |
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|---|---|---|---|---|
| Track |
Track 1 Smart Mobility |
Track 2 Power & Energy |
Track 3 Cloud-connected Autonomous Things |
Track 4 ST & Partner Solutions |
| 11:00 - 11:30 | Stellar MCU with Ethernet Ring & AI | ORv3 5.5kW AI Server Power Platform | 60GHz Short-Range High-Speed Wireless Communication | Edge AI – From Demo to Deployment |
| 11:30 - 12:00 |
Smart Switches for Vehicle Electrification | 48V Data-Center Power for Energy-Efficient Computing | ST MEMS Sensors for Smarter IoT Devices |
STM32 AI Solutions
|
| 12:00 - 13:30 | Lunch & Demo Experience | |||
| 13:30 - 14:00 | ST GNSS & IVI for Smarter Cockpits | STM32 Digital Power Control | STM32MP for HMI Systems | ST Robotics Strategy & Applications |
| 14:00 - 14:30 | Automotive Imaging & MEMS Evolution | ST Battery Management Systems (BMS) | eSIM & NFC for Smarter Connectivity |
High-Power Cooling System for AI Servers
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| 14:30 - 15:00 | ST Power Devices for Efficient Mobility | Analog Design for Servers & Datacenters | Implementing Security on STM32 | ST COT+ for LEO Satellites & Silicon Photonics |
| 15:00 - 15:20 | Coffee Break & Demo Experience | |||
| 15:20 - 15:50 |
ST Smart Gate Drivers for EV Performance
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ST Power Devices for Converter Efficiency & Reliability
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Imaging & ToF Sensing for Robotics |
Dual-Motor FOC for Robot Hands & Humanoids
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| 15:50 - 16:20 | NFC + EEPROM for Enhanced Smart Mobility | SiC MOSFET Gate-Drive Optimization |
ST Wireless & IoT Connectivity Solutions
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Edge AI & Biomimetic Sensing with MCUs |
| 16:20 - 16:30 | Lucky Draw & Closing | |||
Ester holds an MSc in Electronic Engineering (2004) and Ph.D. in Electrical Engineering from the University of Catania (2009). She joined ST in 2005. After 6 years designing analog controllers for SMPS, Ester has spent the last 9 years in technical marketing for analog and power across the EMEA region, focusing on GaN transistors.
Angelo supports Italian customers in designing Power Electronics and optimizing EMC problems. He studied electronic engineering at the Mediterranean University of Reggio Calabria (B.S.) and graduated with a Master's degree in electronic engineering from the Polytechnic of Turin.
Using SiC MOSFETs and STM32G4 digital control, this power solution complies with the OCP Open v3 standard, delivering high power density and superior conversion efficiency for stable Rack, energy-efficient AI server operation.
Based on the STB-UCL topology, this design delivers 1.6 kW ¼-brick high-power density and supports over 6 kW parallel output, providing efficient and stable power conversion for next-generation AI data centers.
The PBD board from ST delivers 12 kW power with a compact design, helping NVIDIA reduce cable bulk and enhance system efficiency. This design reliably provides 12 kW power with a conversion efficiency exceeding 98%. At a 50V output, it achieves a power density of over 2,600 W/in³, fully demonstrating ST’s technical expertise in high-voltage server power architectures.
Featuring an integrated Vienna PFC architecture with SiC and Si support, this system is driven by a single STM32G4 controller to achieve high-efficiency, stable thermal management for continuous AI server performance.
An STM32N6 AI camera performs real-time gesture recognition, while the STM32MP257 programmable controller drives the robotic hand, showcasing ST’s complete integration of AI sensing and motion control.
The STM32 ZeST (zero-speed full-torque) and HSO (high-sensitivity observer) algorithms enable sensorless control of BLDC and PMSM motors from zero to high speed, ensuring smooth operation and precise performance without external sensors.
ST Edge AI technology spans diverse applications, extending from sensing to computation to deliver smarter, faster, and more efficient AI at the edge—driving the next generation of intelligent devices.
ST MEMS sensing technology advances IoT development by connecting data and intelligence, featuring a new generation of MEMS sensors with built-in AI that enhance accuracy and system efficiency.
ST’s automotive image-sensing technology enhances in-cabin monitoring for driver (DMS) and passenger (OMS) applications. The Vx1940 5.1 MP sensor supports both global-shutter and rolling-shutter modes for high-performance vision systems.
Acting as a gateway between the central automotive computer and traditional ECUs, the Zonal Control Unit integrates ST’s automotive-grade components to improve in-vehicle network efficiency and scalability.
Since launching its first automotive-grade GNSS chip in 2011, ST has continuously advanced its positioning technology. In 2020 it introduced a dual-band ASIL-B version, followed by a tri-band chip in 2021, and will debut the world’s first quad-band automotive GNSS solution in 2025, delivering high-precision and reliable positioning performance.
The L9965x chipset features a modular architecture for high-accuracy voltage and current monitoring of battery cells and modules. It supports single or dual daisy-chain topologies and complies with ASIL-D automotive safety standards for reliable battery monitoring and balancing.
The ST60A2 enables high-speed wireless video transmission and, with companion ICs, supports DisplayPort, V-by-One, CSI-2 and DSI interfaces. This demo uses an iPad to wirelessly stream video to a display via DisplayPort and wireless charging through a Niikin protective sleeve.
Powered by STM32MP2, this industrial gateway connects to AWS Cloud for equipment status monitoring and uses post-quantum cryptography to secure communications between edge devices and the cloud.
STSAFE secure elements integrate seamlessly into device designs and operate with the main processor to authenticate devices and ensure system integrity and data protection.
